| Weight / Volume / size | |
|---|---|
| Material | |
| Brand |
Wafering Blade, Diamond Metal Bond, High Concentration, 4″ x 0.012″ x ½” (102 x 0.31 mm)
Additional information
Data Sheet
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MICL supports the Semiconductor, Military, and Microelectronics industries, as well as a wide range of R&D industries. In addition, MICL supports ALL local Academic and Nano Development centers.
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MICL cooperates with several global companies in order to provide turn-key solutions for
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