MICL in-house FA services include:
• Specialized micro CNC services for Package and Die level De-procesing
• Down size and precision sectioning for a wide range of materials: hard soft or brittle
• Parallel delayering and parallel polishing revealing the through structure
• Laser de-capsulation
• Jet Etch - wet etch chemical de-capsulation
• Demo - System and Process Demonstration for evaluation and feasibility
Please contact us for more details.
Cu Bond Decapsulation
